In advanced semiconductor and optoelectronic equipment, complexity goes beyond macroscale form. Many components-such as optical lenses, MEMS sensors, and laser housing elements-involve high-precision microstructures with sub-millimeter features. These features demand a combination of ultra-fine resolution and multi-axis control far beyond conventional machining capabilities.
The Challenge: Geometry at the Micro Scale
Complex microfeatures introduce a unique set of manufacturing challenges:
Microchannels, thin walls, and curved profiles
Sub-100 μm tolerances across multiple planes
Risk of tool deflection, burr formation, or thermal damage
For example, in the production of MEMS pressure sensors, the internal cavities must maintain exact volumes and shapes. Even a 10-micron deviation can disrupt the entire device's sensitivity and functionality.
Why Traditional Tools Fail
When using standard tools:
Oversized or rigid cutters cause structural deformation
Tool wear or vibration creates surface defects
Heat from machining leads to warping or delamination in layered materials
This is especially critical for parts like laser optics brackets or image stabilization housings, where any distortion can result in signal misalignment or focus failure.
Our Solution: Multi-Axis Micro-Machining, Calibrated for Precision
At MID Precision, we utilize:
5-axis micro-CNC milling to handle undercuts and compound angles
Ultra-sharp micro tools (Ø < 0.2mm) for high-aspect ratio details
Low-force cutting strategies and thermal control to prevent micro-deformation
Surface finishing below Ra 0.2 μm for optical or sealing zones
Real-World Application: MEMS Sensor Frames
In one case, we produced aluminum MEMS sensor housings with internal channels <0.3mm in width and wall thicknesses below 0.15mm. Through precision fixturing and in-process measurement, we maintained concentricity and flatness within 5 μm across 20+ cavities-without requiring secondary EDM or post-processing.
Trusted by High-Tech Innovators
Our micromachining solutions support:
Photonic assemblies
Semiconductor wafer transport arms
Laser alignment blocks
Aerospace-grade sensor modules
With a deep understanding of both material behavior and geometric requirements at the micro level, we help clients reduce iteration cycles and increase part functionality-right from the prototype stage.
