Processing product features
Material: High-purity quartz glass (SiO₂ content ≥ 99.99%)
Process: Cavity chamfer grinding (diameter 408mm × thickness 20.5mm)
Precision requirements: Contour ≤ 0.02mm, roughness Ra ≤ 0.8μm
Industry challenges and pain points
A. Quartz glass processing characteristics
High brittleness, edge collapse defect rate exceeds 30%
Concave aspheric surface processing is prone to contour distortion
Traditional grinding wheel grinding is prone to sub-surface microcracks
B. Traditional solution defects
Low efficiency: Single piece processing takes more than 72 hours
Lack of precision: Contour fluctuation reaches 0.03mm
Surface damage: Roughness can only be controlled at Ra1.2μm
MID Solutions: Ultrasonic green processing system
Equipment: Five-axis linkage ultrasonic milling center (integrated online optical detection)
Process: 20kHz high-frequency ultrasonic assisted grinding (coolant temperature control ±1℃)
Quality control: Real-time compensation for processing deformation, 40% improvement in accuracy
Measured performance breakthrough
Edge collapse control: The defect volume is reduced from 0.433mm to 0.049mm (a decrease of 88.7%)
Surface quality: Roughness Ra0.58μm (27.5% better than the industry standard)
Contour accuracy: Stable to 0.015mm
