Processing product characteristics
In the field of semiconductor equipment manufacturing, the processing of precision parts often faces many challenges. A quartz glass electrode block commissioned by a customer is made of high-hardness quartz glass and needs to be precisely processed with a size of D32x3mm. The key processing features include through-hole, end face and annular groove milling. As a core component of semiconductor equipment, this component is directly related to the operating accuracy of the entire equipment.
Industry processing pain points
Traditional processing solutions have exposed significant defects in dealing with such high-precision requirements: low processing efficiency causes a single piece to take up to 90 minutes, brittle material processing is prone to edge collapse defects, and surface roughness is difficult to meet the mirror effect requirements. What's more serious is that the component needs to complete multiple processing steps in one clamping, and the cumulative error of traditional processes can easily lead to product scrapping.
BISHEN Solution Innovation Practice
For this typical processing problem in the semiconductor industry, BISHEN solution has achieved breakthroughs through technology integration:
Ultrasonic precision engraving and milling system: Using high-frequency vibration processing technology, the contact mode between the tool and the workpiece is changed from continuous cutting to pulse processing, effectively reducing cutting stress
Integrated PCD micro-blade tool: The edge precision of the special diamond tool reaches the micron level, and the ultrasonic system is used to achieve the "cold processing" effect
Harmonic four-axis turntable: ±0.002mm repeatable positioning accuracy to ensure the position accuracy of multi-process processing
Technical breakthrough results
After implementing the BISHEN solution, the processing time of a single piece was sharply reduced from 90 minutes to 30 minutes, and the efficiency was increased by 233%. The Ra value of the processed surface roughness is stably controlled within 0.1μm, achieving an optical mirror effect. After three-coordinate detection, the workpiece size tolerance fully meets the ±0.005mm requirements of the drawing, and the processing yield rate has increased from 65% of the traditional process to more than 98%.
About BISHEN:
BISHEN has been deeply involved in the field of precision machining for more than ten years, focusing on providing high-end manufacturing solutions for industries such as semiconductors, optics, and medical devices. The company has independently developed ultrasonic precision machining systems and professional process teams, and has served more than 200 high-end manufacturing companies, maintaining a leading position in the field of hard and brittle material processing. Through continuous technological innovation, BISHEN is helping China's precision manufacturing industry break through more "neck-stuck" technical bottlenecks.
